Difference between SVG/PDF and Gerbers

Hello all.

I created a part (smd) for fritzing and used it in a test circuit design just to make sure everything is OK. I get proper copper pads when I export the file in SVG and PDF.

pdf_export

When I try to export in Gerber format and inspect the file through an app (or even online at jlcpcb) I see that a couple of pads are too close.

gerber

Any ideas where I should be looking at?

I have attached the part in case anyone would like to have a go and compare the Gerber exports.

JDY-23 BLE 5.0 Module.fzpz (18.6 KB)

I recreated the part again. It seems the issue is now gone! I did had to correct some parts in the previous SVG file for the PCB view.

This is how it looks now in PDF export:
export_2

and how it looks in Gerber export:
export_1

Print testing looked fine.

I also uploaded the part in case somebody needs it.

JDY-23 Bluetooth LE Module.fzpz (14.2 KB)

Sorry for the late reply, I have been busy. Over all a good part but a few improvements. Most of the problem is a lack of termnalIds in schematic. Your current part looks like this:

note the wires connect to the middle of the pin (no terminalId defined) and the right and left pins are offset 0.05in from the grid (for the same reason!) Here is the schematic from my improved part which corrects these issues:

note schematic is slightly smaller than your original to get it to fit the grid correctly. As well breadboard and schematic svgs lack layerIds. That results in the part not exporting as an image (i.e a pdf, png, jpg etc.) Here is a list of all the things I changed in your original part:

bb

no layerId, wrong scale, pins don’t start at 0.

ungroup rescale

move connectors to the bottom of the svg renumber

schematic

no layerId wrong scale, origin not 0 0, pins mis aligned, incorrect colors and fontsize.

Replace with a schematic generated by Inkscape extension which will require a renumbering in breadboard.

I created the new schematic with this Inkscape extension:

pcb

silkscreen is not a group which it needs to be.

Renumber the pads to start at connector0 and end in pad to match schematic (needs changes to .fzp file)

fzp file

renumber the pins, remove the bus definition.

most of them make no visual or operational change, they just make the part conform to the parts standards. Here is the part with the above changes in it (I didn’t change the moduleId so you will need to delete your current part to be able to load this one!) Hope it helps. If anything isn’t clear feel free to ask.

JDY-23 Bluetooth LE Module-improved.fzpz (8.9 KB)

Peter

Hi Peter, than you for taking a look at my part.

I missed all those guides when I was creating the part to be honest, but I really like your details explanations which I will be using as a reference along with this part for any future parts I will be making.

Thanks again,
Stelios