The angle is not the best, but it looks like the prototype pads at the right end are aligned with the final pin in the (top) side row of header pins. Then, the top most (short) row of pads appears to have a 0.1 inch offset from that side header row. Assuming the rest is a standard Arduino Mega shield footprint makes it possible. The surface mount pad position should not be critical, since there does not seem to be any mechanical interaction with the rest of the spacing. The hardest part there, is to get the bus right for the smd pad to prototype pad/hole. It would ‘nice’, if could drop a bare chip on that and get the connections.
Does not help with the ‘work’ part, but should be enough for the positioning.