Hello community
I have designed a easy breakout for testing the new footprints from apa102, 2020(6pad),
1515(6-pad), and bigger pad versions for easier visual examination,
It is possible, though unpractical, to hand-solder with the big pad 1515/2020s
I completed my test board with some hot plate resoldering,
the 6-pad version is far more easier to use than its 8-pad counterpart, can achieve higher density on laying out.
At least they don’t short that much often.
apa102testsketch2222.fzz (212.6 KB)
notice the sequence of Vdd and Gnd layout has changed, due to the designs of new IC chip.
apa102-1515-6-pad is byfar the smallest of its kind yet. not sure if there’s going to be smaller ones.I heard they are designed on a remote version of such chip, powered by wireless magic
so powerwire and datewire are not needed. I’m not sure if the magic is possible.
Thank you all involved,
peace 