i want to enlarge the copper area around my pads, and via’s. on my whole board. when solder mask was applied. the solder mask bled into the copper pads. i want to enlarge them so there is less chance of this happening?
I would guess that is a problem on the board maker’s side. I don’t think there is a way to increase the mask offset in Fritzing (although I have also never tried) but it should happen automatically, Fritzing adds some amount of offset to the gerber mask layer I believe. Check the gerber output with a gerber viewer to see how much clearance there is in the mask.
Peter
oh ok thanks. i’ll check that