I am designing a board that has no throw hole components and therefore has nothing on the back other than traces, vias amd capacitive touch pads covered by soldermask.
I have made a vector ( svg ) monochrome silk screen design that covers the entire back of the board, this is both for aesthetic and to highlight the capacitive touch pads. This is all good and I’ve imported it into Fritzing and it’s the exact size and everything.
However, when I export the Gerbers for production and view them in any online gerber-viewer, I can see that Fritzing has made holes all over the silkscreen design where ever there is a via. I’m assuming it’s because there are also holes in the soldermask layer where ever there is a via and Fritzing only allows silkscreen over solder mask (?).
Is there a way to prevent this from happening? Either by forcing soldermask over the vias or by editing the silk screen layer manually?